Numerical Analysis of Flow Boiling Characteristics of a Single Channel Heat Sink Subjected to Multiple Heat Sources

High-power electronic devices with multiple heat sources often require temperature uniformity and to operate within their functional range for optimal performance. Micro-channel cooling could satisfy the dissipation requirements, but it may cause non-uniformity. In this paper, simulations are performed different geometric parameters of channel position source. The results show that a flattened can effectively reduce source temperature, broadening straight flow resistance enhance transfer, while widening at bend lead local dryness. Meanwhile, thermal model is established analyze influence also increase in curved radius, phenomenon vapor–liquid separation becomes more obvious, pressure drop decreases, transfer effect worsens.